What happened in this case?
An appeal in the United States Court of Appeals for the Ninth Circuit between DePuy Synthes Sales, Inc., et al and Howmedica Osteonics Corp., et al. The court issued a decision on Mar 14, 2022.
United States Court of Appeals for the Ninth Circuit
Where this case stands
The side that won in the lower court won again. The court left the lower court's decision in place.
In the court's words:
“Furthermore, because the district court did not err in holding the forum- selection, non-compete and non-solicitation clauses void under California law, we affirm the grant of partial summary judgment and the entry of judgment in favor of DePuy and Waber.”
The lower court's ruling stands.
Jurvio has no record of a later decision overruling it. Our citation records are not complete, so this is not a guarantee.
Plain-English summary, not legal advice. Generated from the court record by fixed rules; quotes are the court's own words. If the record doesn't say, we say so instead of guessing.
Quick answers
Short answers drawn from the court record. If the record doesn't say, we leave it out rather than guess.
An appeal in the United States Court of Appeals for the Ninth Circuit between DePuy Synthes Sales, Inc., et al and Howmedica Osteonics Corp., et al. The court issued a decision on Mar 14, 2022.
The latest dated event in the record is “Decision issued” on Mar 14, 2022.
The court issued its decision on Mar 14, 2022. The full text of the opinion is available on this page.
Mar 14, 2022: Decision issued
Understand this case
DePuy Synthes Sales, Inc., et al v Howmedica Osteonics Corp., et al is United States Court of Appeals for the Ninth Circuit case number 21-55126. Jurvio currently provides 1 readable court document for this case.
Opinion type: Majority opinionThe opinion expressing the reasoning supported by most judges deciding the case.Learn more about majority opinion →
Cites 28 cases · 3 on Jurvio
Available court materials
Court documents Jurvio has for this case. More will appear here as we add them.